| Materials |
Polyimide
(Kapton) |
Remark&
Test Method |
| Number of Layer |
|
1~8£¨Rigid-Flex & Multilayers FPC£© |
|
|
Min. Track
Width/Spacing |
Single Sided |
0.030 mm / 0.040 mm |
|
| Double Sided |
0.030 mm / 0.050 mm |
|
|
Min. Hole
Diameter |
Drilling P.T.H. |
0.2 mm |
|
| Punching |
1.0 mm |
|
| Dimension
Tolerances |
Conductor Width (W) |
0.020 mm |
W0.5mm |
| Hole Diameter (H) |
0.05 mm (withP.T.H.0.1mm) |
H1.5mm |
| Accumulated Pitch (P) |
0.015 mm |
P25mm |
| Outline Dimension (L) |
0.05 mm |
L50 mm |
| Conductors and Outline (C) |
0.15 mm (Special 0.07mm) |
C5.0 mm |
| Conductors and Coverlay |
0.3~0.5 mm |
|
|
Surface Treatment on
Terminals and land Areas |
Soft or Hard Ni/Au Sn/Pb (2~60¦Ìm) Primary FluxCarbon Printed (4~10¦Ìm Silver Gel printed |
|
| Insulation Resistance |
1000MW |
IPC-TM-650 2.6.3.2
at Ambient |
| Dielectric Strength |
5KV |
IPC-TM-650 2.5.6.1 |
| Surface Resistance (W) |
5x012 |
IPC-TM-650 2.5.17 |
| Volume Resistivity (W-cm) |
1x015 |
IPC-TM-650 2.5.17 |
| Dielectric Constant (1 MHz) |
4.0 |
IPC-TM-650 2.5.5.3 |
| Dissipation Factor (1 MHz) |
0.04 |
IPC-TM-650 2.5.5.3 |
| Peeling Strength (180 irection) |
1.2kgf/cm |
IPC-TM-650 2.4.9 |
| Solder Heat Resistance |
260 .C/10secs |
|
| Flammability |
94 V-0 |
UL94 |
| Water Absorption |
2.9% |
ASTM D570%
(24 Hours) |
