Product Feature  
 

• Single or Double Sided Circuitry
• Multilayer, 2 to 8 FPCB & Rigid-Flex PCB
• Lines and Spaces: Single sided 1.6mil; Double sided 1.6mil;
• Installation of Connectors, Pins, Contacts, etc.
• Assembly including SMD
• Stiffener Supported Areas (using FR-4, Polyamide, Polyester, etc.)
• Unsupported Fingers
• Blind and buried vias
• Controlled impedance
• Selective Adhesive
• Shielding, solid or patterned
• Forming and Creasing
• Circuits up to 18" x 24" 

Surface Treatmean and Finishes 
 

• Hard or Soft Gold
• Hot Air Level (H.A.L).
• Carbon Printing
• Screen Print Solder Mask
• Tin Plating - Electroless and Electrolytic
• Silver
• Nickel 

Materials 
 

Substrates 

• Kapton Polyimide 1/2 – 5 mils
• Epoxy
• Teflon 

Copper 

• 1/2 ounce to 7 ounces
• Rolled-annealed
• Half Hard Electro-deposited 

Adhesives 

• Modified Acrylic
• Modified Epoxy
• Pressure Sensitive (PSA) 

Solder Mask / Coverlay  

• Kapton Coverlay 1/2 mil to 5 mils
• Photoimageable Coverlay
• SolderMask 

Note: Special sizes are available upon request